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Ultra Soft CPU Thermal Pad For Telecommunication Hardware

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Dongguan Ziitek Electronical Material and Technology Ltd.

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Ultra Soft CPU Thermal Pad For Telecommunication Hardware

Name: Ultra Soft CPU Thermal Pad For Telecommunication Hardware
Brand: Ziitek
Price: 0.1 USD

Wholesale Ultra Soft CPU Thermal Pad For Telecommunication Hardware from china suppliers

Brand Name : Ziitek

Model Number : TIF112-12-10S-K1

Certification : UL & RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-5 work days

Packaging Details : 24*23*12cm cantons

Products name : Ultra Soft CPU Thermal Pad For Telecommunication Hardware

Thickness : 0.012"(0.30mm)

Specific Gravity : 2.2g/cc

Dielectric Breakdown Voltage : >5500 VAC

Thermal conductivity : 1.2W/m-K

color : Gray

Operating Temp : -40~120℃

Keywords : CPU Thermal pad

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Ultra Soft CPU Thermal Pad For Telecommunication Hardware

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Product introduction

TIF112-12-10S-K1 Series thermally conductive interface materials are gap fillers reinforced one side with kepton; the other side with adhesive.They are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and viscoelastic feature make them ideal to coat very uneven surfaces. lts smooth, puncture, tear, wear-resistant reinforcement surface is perfect for reworking and plug-in devices.

Ultra Soft CPU Thermal Pad For Telecommunication Hardware

Features
> Good thermal conductive: 1.2W/mK
> Available in varies thickness
> UL recognized
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant

Applications
> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices

Typical Properties of TIF112-12-10S-K1 Series
Property	Value	Test method
Color	Gray/ Light amber	Visual
Construction &Compostion	Ceramic filled silicone elastomer	***
Renforcement carrier	Polyimide film	***
Thickness range	0.012"(0.30mm)	ASTM D374
Hardness	60±5 Shore C	ASTM 2240
Specific Gravity	2.2 g/cc	ASTM D792
Continuos Use Temp	-40 to 120℃	***
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149
Dielectric Constant	4.5 MHz	ASTM D150
Volume Resistivity	1.0X10¹²"Ohm-meter	ASTM D257
Fire rating	94 V0	UL E331100
Thermal conductivity	1.2W/m-K	ASTM D5470

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Ultra Soft CPU Thermal Pad For Telecommunication Hardware

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