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3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices

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Dongguan Ziitek Electronical Material and Technology Ltd.

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3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices

Name: 30 WMk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices
Brand: Ziitek
Price: 0.1 USD

Wholesale 3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices from china suppliers

Brand Name : Ziitek

Model Number : TIF170-30-06UF thermal pad

Certification : UL

Place of Origin : China

MOQ : 1000 pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/month

Delivery Time : 3-8 work days

Packaging Details : 25*24*13cm canton

color : white

Specific gravity : 3.0 g/cc

Name : 3.0 W/mK Good Performance Heat Sink Pad RoHS Compliant for Mass Storage Devices

Dielectric Constant : 5.0 MHz

Thermal conductivity : 3.0 W/mK

keyword : Thermal Gap Pad

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3.0 W/mK Good Performance Heat Sink Pad RoHS Compliant for Mass Storage Devices

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

TIF100-30-06UF-Series-Datasheet-.pdf

Ziitek TIF170-30-06UF is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF170-30-06UF is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

<Good thermal conductive:3.0 W/mK

<Thickness: 1.75mmT

<Hardness:75±5 Shore 00

<Colour: White

<Good thermal conductive
<Moldability for complex parts
<Soft and compressible for low stress applications

Applications

<mainboard/mother board

<notebook

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices

Typical Properties of TIF170-30-06UF
Product Name	TIF170-30-06UF Series
Colour	White
Construction & Compostion	Ceramic filled silicone elastomer
Specific gravity	3.0 g/cc
Thickness	1.75mmT
Hardness	75±5 Shore 00
Dielectric constant@1MHz	5.0 MHz
Continuos Use Temp	-40 to 160℃
Dielectric Breakdown Voltage	>5500 VAC
Thermal conductivity	3.0 W/mK
Volume Resistivity	2.3*10^{13 _Ohm-cm}

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices

Our services

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices

FAQ

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

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3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices

3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices

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3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices Images